Development of elemental technologies essential for next-generation automobiles
MITSUBSHI MATERIALS CORPORATION
We regard “next generation automobiles”, “IoT-AI”, “urban mining” and “clean energy and decarbonization" as social needs that the Group should grasp in our medium-term management strategy. In the areas of next-generation automobiles and IoT- AI, we will expand the scope of its copper and aluminum products, seals, wear-resistant tools, and sensors, while developing new products and businesses. In the areas of "Urban Mines" and "Clean Energy and Decarbonization," we will create new products and new businesses from among those related to recycling, renewable energy and hydrogen society.
As specific examples, we have been conducting press releases since 2019 on the development of metal base substrates for high-brightness LEDs for next-generation automobiles, homogeneous electrodeposition coating technology for high-heat-resistant and high-insulation resins, and die-bonding sinter materials for next-generation power modules. We are promoting dissemination by advancing the elemental technology development which is indispensable for these next generation automobiles.
In our Medium-Term Management plan, we consider “next generation automobiles”, “IoT-AI”, “urban mining”, and “clean energy and decarbonization” to be the social needs that we should capture.
In the areas of next generation automobiles and IoT-AI, we will expand the scope of its copper and aluminum products, seals, wear-resistant tools, and sensors, while developing new products and businesses. And in the areas of “Urban Mines” and “Clean Energy and Decarbonization”, the Company will create new products and new businesses from among those related to recycling, renewable energy, and hydrogen society.
As specific examples, the following announcements have been made since 2019 as a technology for next-generation automobiles. We are promoting dissemination by advancing the elemental technology development which is indispensable for those next generation automobiles. We will continue our development to be put into practical use in stages by around 2050.
・ Metal base substrates for automotive high-brightness LEDs
In the headlamp of the next generation automotive, the adoption of the high- brightness LED advances in place of the conventional light source for the energy saving. We have developed a metal-based substrate that is lower in cost than conventional ceramic substrates while having the high heat dissipation required for high-brightness LEDs.
We intend to build the reliability of the printed circuit boards and launch a mass production process in order to commercialize and disseminate them by around 2022
・ Uniform electrodeposition coating technology for high heat resistance and high insulation resin
High insulation reliability under high temperature is required for coils used in power inductors, motors and reactors, which is used in inverters for controlling high-output motor power supply of next generation automobiles.
Recently, with demand of further miniaturization of those coil devices, a uniform coating technology is getting required to perform insulation of complex-shaped conductors.. We have developed a unique electrodeposition technology that can uniformly coat resin film with high heat resistance and high insulation property even for complex shapes.
In the future, further upgrading of film characteristics will be carried out, and the construction of mass production process of electrodeposition machining will be aimed at by around 2022.
・ Die-bonding sinter materials for next generation power modules
In the next generation type power module used in the inverter for high output motor power supply control of the next generation automotive, there is a demand of the function enhancement in the die bonding for high-temperature operating semiconductor element such as SiC to the copper material. Previously, it was necessary to apply precious metal plating such as gold and silver to the substrate surface, and pressurize while heating. We have developed a die bonding material that can bond semiconductor die to substrate without pressure nor precious metal plating to the copper surface of the substrate, and can exhibit the bonding strength and heat resistance equivalent to the conventional die bonding products.
In the future, further improvement of reliability and optimize of the process will be carried out, and the commercialization and dissemination will be aimed at around 2021.
Developing nBoard™ metal-base substrates for automotive high-brightness LEDs
Development of Uniform Electrodeposition Coating Technology for Highly Heat-Resistant and Highly Insulating Resins for Next-Generation Vehicles
Development of die-bonding sinter materials for next-generation power modules that can be bonded to copper components without pressure
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